https://openalex.org/T11527
This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.
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skos:definition "This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking."@en ;
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openalex:cited_by_count 263649 ;
openalex:works_count 33518 .