https://openalex.org/T11301
This cluster of papers focuses on the techniques, mechanisms, and simulations related to chemical mechanical polishing (CMP) in the context of microelectronics manufacturing. It covers topics such as material removal mechanisms, molecular dynamics simulation, ultra-precision grinding, surface and subsurface damage, nanometric cutting, magnetorheological finishing, polishing slurry chemistry, and tool wear.
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openalex:cited_by_count 430319 ;
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